JPS6150749B2 - - Google Patents
Info
- Publication number
- JPS6150749B2 JPS6150749B2 JP58058675A JP5867583A JPS6150749B2 JP S6150749 B2 JPS6150749 B2 JP S6150749B2 JP 58058675 A JP58058675 A JP 58058675A JP 5867583 A JP5867583 A JP 5867583A JP S6150749 B2 JPS6150749 B2 JP S6150749B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- workpiece
- rotating body
- whetstone
- position detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000007246 mechanism Effects 0.000 claims description 43
- 239000012530 fluid Substances 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 239000000969 carrier Substances 0.000 description 17
- 238000003754 machining Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58058675A JPS59187447A (ja) | 1983-04-05 | 1983-04-05 | 研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58058675A JPS59187447A (ja) | 1983-04-05 | 1983-04-05 | 研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59187447A JPS59187447A (ja) | 1984-10-24 |
| JPS6150749B2 true JPS6150749B2 (en]) | 1986-11-05 |
Family
ID=13091148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58058675A Granted JPS59187447A (ja) | 1983-04-05 | 1983-04-05 | 研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59187447A (en]) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61226253A (ja) * | 1985-03-30 | 1986-10-08 | Mitsubishi Metal Corp | 平行平面自動研削装置 |
| JPH0775830B2 (ja) * | 1985-12-04 | 1995-08-16 | 東芝機械株式会社 | ポリシヤ−におけるワ−ク搬入出装置 |
| JP2546640B2 (ja) * | 1986-04-07 | 1996-10-23 | 東芝機械株式会社 | 研磨装置におけるキヤリア位置決め方法 |
| DE3730795A1 (de) * | 1987-09-14 | 1989-03-23 | Wolters Peter Fa | Hon-, laepp- oder poliermaschine |
| JPH0425375A (ja) * | 1990-05-16 | 1992-01-29 | Showa Alum Corp | 研磨装置 |
| JPH0615565A (ja) * | 1991-12-18 | 1994-01-25 | Shin Etsu Handotai Co Ltd | ウエーハ自動ラッピング装置 |
| CN115625570B (zh) * | 2022-12-23 | 2023-03-14 | 新乡市斯凯夫机械有限公司 | 一种带有自动上下料机构的双端面研磨机 |
-
1983
- 1983-04-05 JP JP58058675A patent/JPS59187447A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59187447A (ja) | 1984-10-24 |
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